H05K 2201/09709
Staggered pads, lands or terminals
Official title: Staggered pads, lands or terminals; Parallel conductors in different planes
H05K2201/09709 (Staggered pads, lands or terminals) appears on 405 US grants and 388 published applications in this corpus.
Search patents in H05K- Granted patents
- 405
- Published applications
- 388
- Assignees
- 237
- Inventors
- 936
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 0 | 0 |
| 1989 | 6 | 0 |
| 1990 | 3 | 0 |
| 1991 | 6 | 0 |
| 1992 | 5 | 0 |
| 1993 | 5 | 0 |
| 1994 | 4 | 0 |
| 1995 | 6 | 0 |
| 1996 | 5 | 0 |
| 1997 | 5 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 11 | 0 |
| 2001 | 6 | 1 |
| 2002 | 7 | 7 |
| 2003 | 7 | 17 |
| 2004 | 14 | 20 |
| 2005 | 10 | 14 |
| 2006 | 16 | 15 |
| 2007 | 10 | 16 |
| 2008 | 14 | 20 |
| 2009 | 9 | 27 |
| 2010 | 11 | 21 |
| 2011 | 13 | 22 |
| 2012 | 24 | 18 |
| 2013 | 17 | 15 |
| 2014 | 9 | 18 |
| 2015 | 16 | 23 |
| 2016 | 20 | 13 |
| 2017 | 24 | 18 |
| 2018 | 13 | 20 |
| 2019 | 16 | 12 |
| 2020 | 13 | 12 |
| 2021 | 14 | 18 |
| 2022 | 12 | 9 |
| 2023 | 9 | 12 |
| 2024 | 11 | 9 |
| 2025 | 8 | 7 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Guided pad structures formed in circuit board5 May 2026US 12,621,931 B2Dell Products L. P.
- Non-uniform surface mount pads20 Jan 2026US 12,532,415 B2Dell Products L. P.
- Array substrate and display apparatus16 Dec 2025US 12,501,791 B2Beijing BOE Technology Development Co., Ltd.
- Reflective cancellations in a connector wipe of a surface mount connector25 Nov 2025US 12,484,143 B2Dell Products L. P.
- Reflective cancellations in a connector wipe11 Nov 2025US 12,471,207 B2Dell Products L. P.
- Printed circuit board hardware interface with reduced crosstalk20 Aug 2026US 2026/0247522 A1Microsoft Technology Licensing, LLC
- Connector28 May 2026US 2026/0149218 A1Japan Aviation Electronics Industry, Limited
- Flexible printed circuit board, display device, electronic device, and method for manufacturing a display device5 Mar 2026US 2026/0068038 A1Samsung Display Co., Ltd.
- Via hole structure of circuit board, and circuit board26 Feb 2026US 2026/0059652 A1Zte Corporation
- Circuit board, semiconductor module and semiconductor system4 Dec 2025US 2025/0374427 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Plated plastic castellated interconnect for electrical components301US 5,069,626 AWestern Digital Corporation · 1991
- Arrangement of integrated circuits in a memory module250US 6,751,113 B2Netlist, Inc. · 2004
- Flexible printed circuit with removable testing portion238US 9,717,141 B1St. Jude Medical, Atrial Fibrillation Division, Inc. · 2017
- Arrangement of integrated circuits in a memory module173US 6,873,534 B2Netlist, Inc. · 2005
- Flexible connector for circuit boards161US 5,742,484 AMotorola, Inc. · 1998