Via hole structure of circuit board, and circuit board
AssigneeZte Corporation
InventorsXiaoying REN, Jinlong LI, Zhongmin WEI, Xin KANG
Life of this patent
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Abstract
Provided in the present disclosure are a via hole structure of a circuit board, and a circuit board. The via hole structure comprises at least one pair of differential signal holes, wherein each pair of differential signal holes comprises a first differential signal hole and a second differential signal hole. In a thickness direction of the circuit board, there are several distances between the central axis of the first differential signal hole and the central axis of the second differential signal hole, and numerical values of at least two distances are different.
Claims20
A via hole structure of a circuit board, comprising at least one pair of differential signal holes, wherein each pair of differential signal holes comprises a first differential signal hole and a second differential signal hole;
- and
- in a thickness direction of the circuit board, there are several distances between a central axis of the first differential signal hole and a central axis of the second differential signal hole, and numerical values of at least two distances are different.
A circuit board, comprising a via hole structure, the via hole structure comprises at least one pair of differential signal holes, wherein each pair of differential signal holes comprises a first differential signal hole and a second differential signal hole;
- and
- in a thickness direction of the circuit board, there are several distances between a central axis of the first differential signal hole and a central axis of the second differential signal hole, and numerical values of at least two distances are different.
Dependencies are inferred from the claim text.