Guided pad structures formed in circuit board
AssigneeDell Products L.P.
InventorsJames L. Petivan, Bhyrav M. Mutnury, Sandor T. Farkas
Life of this patent
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Abstract
A circuit board may include a plurality of electrically-conductive layers separated and supported by a plurality of dielectric layers of insulating material laminated together and a channel formed at an edge of the circuit board through at least one dielectric layer of the plurality of dielectric layers within which an electrically-conductive pad is formed from an internal electrically-conductive layer of one of the plurality of electrically-conductive layers.
Claims21
A circuit board, comprising:
- a plurality of electrically-conductive layers separated and supported by a plurality of dielectric layers of insulating material laminated together;
- and
- a channel formed at an edge of the circuit board through at least one dielectric layer of the plurality of dielectric layers within which an electrically-conductive pad is formed from an internal electrically-conductive layer of one of the plurality of electrically-conductive layers, wherein the at least one dielectric layer forms a first wall of the channel and a second wall of the channel opposite to the first wall.
An information handling system comprising:
- a processor;
- and
- a circuit board, comprising:
- a plurality of electrically-conductive layers separated and supported by a plurality of dielectric layers of insulating material laminated together;
- and
- a channel formed at an edge of the circuit board through at least one dielectric layer of the plurality of dielectric layers within which an electrically-conductive pad is formed from an internal electrically-conductive layer of one of the plurality of electrically-conductive layers, wherein the at least one dielectric layer forms a first wall of the channel and a second wall of the channel opposite to the first wall.
A method comprising, in a circuit board having a plurality of electrically-conductive layers separated and supported by a plurality of dielectric layers of insulating material laminated together:
- forming a channel at an edge of the circuit board through at least one dielectric layer of the plurality of dielectric layers, wherein the at least one dielectric layer forms a first wall of the channel and a second wall of the channel opposite to the first wall;
- and
- forming within the channel an electrically-conductive pad from an internal electrically-conductive layer of one of the plurality of electrically-conductive layers.
Dependencies are inferred from the claim text.