Non-uniform surface mount pads

A method comprising:

• for a first pad of a first trace of a circuit board, connecting a first connector pin for a first signal of a surface mounted device (SMD) to the first pad, in which a connector pin leg of the first connector pin connects to the first pad and, regardless of which direction the first trace extends from the first pad, a stub portion of the first pad is formed having a dimension that reduces insertion loss due to the stub portion;
• and
• for a second pad of a second trace of the circuit board, connecting a second connector pin of the SMD to the second pad, which comprises at least one dimension larger than the first pad to provide increased mechanical connection between the second connector pin and the second pad relative to mechanical connection between the first connector pin and the first pad.

A method comprising:

• driving a signal via a first signal path involving a surface mounted device (SMD) connected to a circuit board, in which the first signal path comprises:
• a first connector pin leg of a first connector pin of the SMD that is coupled to a first pad of the circuit board to form a first connection;
• and a trace that extends from the first pad, in which the first pad is sized to limit signal degradation by such that, regardless of which direction the trace extends from the first pad, forms a stub formed from a portion of the first pad that is not part of the first signal path does not degrade the signal more than a threshold amount, wherein the SMD is connected to the circuit board via a second connection formed from a second connector pin leg of a second connector pin being coupled to a second pad having a second size that is larger than a size of the first pad to provide more mechanical connection via the second connection relative to the mechanical connection provided by the first connection.