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US 12,484,143 B2Granted
Reflective cancellations in a connector wipe of a surface mount connector
AssigneeDell Products L.P.
InventorsSandor Farkas, Bhyrav Mutnury
Life of this patent
Estimating the term…
Abstract
A printed circuit board includes a dielectric and a connector. The connector is mounted on the dielectric. The connector includes a first connector lead, a first contact point, and a first connector wipe. The first connector wipe includes a plurality of low impedance bumps. The low impedance bumps create an impedance mismatch between the first connector lead and the first connector wipe.
Claims14
A printed circuit board comprising:
- a dielectric;
- and
- a connector mounted on the dielectric, the connector including a first connector lead, a first contact point, and a first connector wipe, the first connector wipe including a plurality of low impedance bumps, wherein the low impedance bumps create an impedance mismatch between the first connector lead and the first connector wipe, wherein a first portion of a signal transmitted along the connector lead is provided to a contact in physical communication with the first contact portion and a second portion of the signal is provided along the first connector wipe, and wherein a first signal propagation velocity for the first portion of the signal along the contact is slower than a second signal propagation velocity for the second portion of the signal along the first connector wipe.
An information handling system comprising:
- a cable connector having an extension portion and a contact portion;
- and
- a printed circuit board including:
- a dielectric;
- and
- a connector mounted on the dielectric, the connector including a first connector lead, a first contact point, and a first connector wipe, the first connector wipe including a plurality of low impedance bumps, wherein the low impedance bumps create an impedance mismatch between the first connector lead and the first connector wipe, wherein a first portion of a signal transmitted along the connector lead is provided to a contact in physical communication with the first contact portion and a second portion of the signal is provided along the first connector wipe, and wherein a first signal propagation velocity for the first portion of the signal along the contact is slower than a second signal propagation velocity for the second portion of the signal along the first connector wipe.
3 more elements
A printed circuit board comprising:
- a dielectric;
- and
- a connector mounted on the dielectric, the connector including a first connector lead, a first contact point, and a first connector wipe, the first connector wipe including a plurality of low impedance bumps, wherein the low impedance bumps create an impedance mismatch between the first connector lead and the first connector wipe, wherein the dielectric includes a ground plane below the first connector lead, wherein the dielectric includes a void below the first connector lead, wherein a first portion of a signal transmitted along the connector lead is provided to a contact in physical communication with the first contact portion and a second portion of the signal is provided along the first connector wipe, and wherein a first signal propagation velocity for the first portion of the signal along the contact is slower than a second signal propagation velocity for the second portion of the signal along the first connector wipe, and wherein a first signal propagation velocity for the first portion of the signal along the contact is slower than a second signal propagation velocity for the second portion of the signal along the first connector wipe.
Dependencies are inferred from the claim text.