H05K 2201/09663
Divided layout, i.e. conductors divided in two or more parts
H05K2201/09663 (Divided layout, i.e. conductors divided in two or more parts) appears on 545 US grants and 513 published applications in this corpus.
Search patents in H05K- Granted patents
- 545
- Published applications
- 513
- Assignees
- 293
- Inventors
- 1,172
- Latest grant
- 13 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 7 | 0 |
| 1992 | 4 | 0 |
| 1993 | 3 | 0 |
| 1994 | 5 | 0 |
| 1995 | 7 | 0 |
| 1996 | 8 | 0 |
| 1997 | 8 | 0 |
| 1998 | 10 | 0 |
| 1999 | 11 | 0 |
| 2000 | 19 | 0 |
| 2001 | 12 | 7 |
| 2002 | 24 | 23 |
| 2003 | 15 | 19 |
| 2004 | 21 | 18 |
| 2005 | 16 | 40 |
| 2006 | 27 | 24 |
| 2007 | 18 | 42 |
| 2008 | 21 | 45 |
| 2009 | 17 | 51 |
| 2010 | 23 | 39 |
| 2011 | 36 | 26 |
| 2012 | 41 | 23 |
| 2013 | 29 | 24 |
| 2014 | 19 | 16 |
| 2015 | 15 | 16 |
| 2016 | 19 | 15 |
| 2017 | 19 | 17 |
| 2018 | 12 | 10 |
| 2019 | 19 | 10 |
| 2020 | 9 | 14 |
| 2021 | 10 | 6 |
| 2022 | 7 | 8 |
| 2023 | 9 | 9 |
| 2024 | 6 | 6 |
| 2025 | 4 | 4 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Flexible printed circuit cable30 Oct 2025US 2025/0338395 A1Microsoft Technology Licensing, LLC
- LED Lamp with Four-wire Double-sided PCB3 Jul 2025US 2025/0216058 A1Shangyou Jiayi Lighting Product Co., Ltd.
- Grounding optimization for unshielded data connections19 Jun 2025US 2025/0203754 A1Marvell Asia Pte Ltd
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Most cited
By later US patents
- Surface mount multilayer capacitor225US 5,880,925 AAVX Corporation · 1999
- Multilayer wiring structure for attaining high-speed signal propagation143US 5,633,479 AKabushiki Kaisha Toshiba · 1997
- Surface mount multilayer capacitor138US 6,243,253 B1AVX Corporation · 2001
- Multilayer printed board120US 5,926,377 AFujitsu Limited · 1999
- Capacitor with defect isolation and bypass118US 6,452,776 B1Intel Corporation · 2002