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US 12,334,405 B2Granted
Electronic devices including vent openings and associated methods
AssigneeInfineon Technologies AG
InventorsMichael Stadler, Thomas Bemmerl
Life of this patent
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Abstract
An electronic device and method is disclosed. In one example, the electronic device includes a solderable surface and at least one surface opening arranged in the solderable surface. The electronic device further includes an encapsulation material, encapsulating at least one electronic component of the electronic device, and at least one vent opening arranged in an area of the surface opening and extending through the encapsulation material.
Claims22
An electronic device, comprising:
- a solderable surface;
- at least one surface opening arranged in the solderable surface;
- an encapsulation material encapsulating at least one electronic component of the electronic device;
- and
- at least one vent opening arranged in an area of the surface opening and extending through the encapsulation material.
2 more elements
A method for manufacturing an electronic device, the method comprising:
- providing an opening in a solderable surface of the electronic device;
- encapsulating at least one electronic component of the electronic device in an encapsulation material;
- and
- forming at least one vent opening in an area of the surface opening, wherein the at least one vent opening extends through the encapsulation material.
1 more element
Dependencies are inferred from the claim text.