H05K 2201/097
Alternating conductors
Official title: Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
H05K2201/097 (Alternating conductors) appears on 254 US grants and 231 published applications in this corpus.
Search patents in H05K- Granted patents
- 254
- Published applications
- 231
- Assignees
- 181
- Inventors
- 571
- Latest grant
- 23 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 10 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 5 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 2 |
| 2002 | 8 | 8 |
| 2003 | 9 | 10 |
| 2004 | 13 | 9 |
| 2005 | 4 | 9 |
| 2006 | 8 | 13 |
| 2007 | 9 | 14 |
| 2008 | 13 | 8 |
| 2009 | 4 | 11 |
| 2010 | 7 | 13 |
| 2011 | 10 | 10 |
| 2012 | 9 | 9 |
| 2013 | 7 | 13 |
| 2014 | 11 | 10 |
| 2015 | 10 | 19 |
| 2016 | 9 | 13 |
| 2017 | 20 | 5 |
| 2018 | 10 | 10 |
| 2019 | 10 | 9 |
| 2020 | 4 | 7 |
| 2021 | 8 | 10 |
| 2022 | 6 | 3 |
| 2023 | 4 | 7 |
| 2024 | 5 | 6 |
| 2025 | 7 | 3 |
By publication year. Applications have been published since 2001.
Recent patents
- Wiring substrate23 Sep 2025US 12,424,534 B2Niterra Co., Ltd.
- Printed circuit board, an antenna arrangement and a communication device23 Sep 2025US 12,424,727 B2Telefonaktiebolaget LM Ericsson (publ)
- Twisted differential compensation for routing high-speed signals near power delivery inductors and system miniaturization23 Sep 2025US 12,426,153 B2Intel Corporation
- Printed wiring board and information processing apparatus23 Sep 2025US 12,426,160 B2Hitachi, Ltd.
- Electronic circuit with temperature detection element22 Jul 2025US 12,366,485 B2Sharp Kabushiki Kaisha
- Mating backplane for high speed, high density electrical connector6 Nov 2025US 2025/0344316 A1Amphenol Corporation
- Lighting-emitting device filament including electrode pads22 May 2025US 2025/0167182 A1Seoul Semiconductor Co., Ltd.
- Detection circuit9 Jan 2025US 2025/0012833 A1Mitsubishi Electric Corporation
- Optical Module5 Dec 2024US 2024/0402428 A1Hisense Broadband Multimedia Technologies Co., Ltd.
- Substrate employing vertical conductor loops for coupling noise reduction in radio-frequency (rf) transmission lines, and related antenna modules and fabrication methods22 Aug 2024US 2024/0282688 A1QUALCOMM Incorporated
Most cited
By later US patents
- Apparatus for interconnecting multiple devices on a circuit board247US 6,434,016 B1Intel Corporation · 2002
- Connector for communication systems with cancelled crosstalk181US 5,432,484 AHubbell Incorporated · 1995
- Telecommunication connector with feedback142US 5,414,393 AHubbell Incorporated · 1995
- Injection molded printed circuits132US 5,220,488 AUFE Incorporated · 1993
- Multi-layer printed board with an inductor providing a high impedance at high frequency106US 6,091,310 ANEC Corporation · 2000