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US 12,424,534 B2Granted
Wiring substrate
AssigneeNiterra Co., Ltd.
InventorKensuke Matsuhashi
Life of this patent
Estimating the term…
Abstract
A wiring substrate includes a first ceramic layer and a second ceramic layer. A plurality of wiring traces which are electrically independent of one another are provided between the first ceramic layer and the second ceramic layer. Each wiring trace has a protruding portion which protrudes onto the first ceramic layer surrounded by the second ceramic layer when viewed from above. An insulating coat is provided to cover a portion of a concave corner formed by the second ceramic layer and the first ceramic layer.
Claims6
A wiring substrate comprising:
- a first ceramic layer;
- a frame-shaped second ceramic layer which is stacked on the first ceramic layer and surrounds a portion of an upper surface of the first ceramic layer when viewed from above;
- and
- a plurality of wiring traces which are electrically independent of one another and are present between the first ceramic layer and the second ceramic layer, each wiring trace having a protruding portion which protrudes onto the first ceramic layer surrounded by the second ceramic layer when viewed from above,
- wherein the wiring substrate comprises an insulating coat which covers a portion of a concave corner formed by an inner circumferential surface of the second ceramic layer, and the upper surface of the first ceramic layer and an upper surface of the protruding portion, and
- wherein an exposed region where the insulating coat is not provided is present at least on a wiring trace which is the largest, in terms of width of a part of the protruding portion, among the plurality of wiring traces, which part is located adjacent to the second ceramic layer when viewed from above.
3 more elements
Dependencies are inferred from the claim text.