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US 2024/0402428 A1Published application
Optical Module
AssigneeHisense Broadband Multimedia Technologies Co., Ltd.
InventorsLong ZHENG, Sigeng YANG
Life of this patent
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AssigneeHisense Broadband Multimedia Technologies Co., Ltd.
InventorsLong ZHENG, Sigeng YANG
Estimating the term…
An optical module includes a circuit board and a silicon optical chip. The circuit board includes a plurality of circuit board bonding pads. The silicon optical chip includes a plurality of chip bonding pads corresponding to the plurality of circuit board bonding pads. The plurality of chip bonding pads are electrically connected to the corresponding circuit board bonding pads, so that the silicon optical chip is electrically connected to the circuit board. A chip bonding pad is electrically connected to at least one corresponding circuit board bonding pad through a plurality of bonding wires, or a circuit board bonding pad is electrically connected to at least one corresponding chip bonding pad through a plurality of bonding wires. The plurality of bonding wires have different heights, with an angle formed between bonding wires with different heights.
An optical module, comprising:
An optical module, comprising:
An optical module, comprising:
Dependencies are inferred from the claim text.