Printed wiring board and information processing apparatus

An information processing apparatus comprising:

• a printed wiring board;
• and
• an element mounted on the printed wiring board,
• wherein the printed wiring board includes:
• an outermost conductive layer that includes a plurality of conductive pads connected to the element;
• a first conductive layer that includes a first inner-layer wiring and is stacked on the outermost conductive layer;
• a second conductive layer that includes a second inner-layer wiring and is stacked on the outermost conductive layer and the first conductive layer;
• a first signal via that connects one of the conductive pads and the first inner-layer wiring with each other;
• a second signal via connecting another one of the conductive pads and the second inner-layer wiring with each other;
• and
• a stitching via that is connected to a ground,
• wherein the first inner-layer wiring and the second inner-layer wiring form a common wiring route in which the first inner-layer wiring and the second inner-layer wiring are stacked and disposed in a connection area in which the conductive pads are arranged,
• wherein the conductive pads are arranged in a matrix at a predetermined arrangement pitch in the connection area, and
• wherein an interval between the first signal via and the second signal via is substantially equal to the predetermined arrangement pitch.