H05K 2201/09781
Dummy conductors, i.e. not used for normal transport of current
Official title: Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
H05K2201/09781 (Dummy conductors, i.e. not used for normal transport of current) appears on 1,514 US grants and 1,521 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,514
- Published applications
- 1,521
- Assignees
- 675
- Inventors
- 3,575
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 4 | 0 |
| 1985 | 9 | 0 |
| 1986 | 7 | 0 |
| 1987 | 11 | 0 |
| 1988 | 8 | 0 |
| 1989 | 9 | 0 |
| 1990 | 19 | 0 |
| 1991 | 15 | 0 |
| 1992 | 12 | 0 |
| 1993 | 20 | 0 |
| 1994 | 10 | 0 |
| 1995 | 24 | 0 |
| 1996 | 18 | 0 |
| 1997 | 22 | 0 |
| 1998 | 33 | 0 |
| 1999 | 27 | 0 |
| 2000 | 30 | 0 |
| 2001 | 49 | 22 |
| 2002 | 52 | 37 |
| 2003 | 44 | 56 |
| 2004 | 51 | 75 |
| 2005 | 38 | 87 |
| 2006 | 60 | 77 |
| 2007 | 45 | 125 |
| 2008 | 56 | 121 |
| 2009 | 61 | 123 |
| 2010 | 81 | 95 |
| 2011 | 79 | 74 |
| 2012 | 78 | 51 |
| 2013 | 58 | 54 |
| 2014 | 44 | 77 |
| 2015 | 53 | 59 |
| 2016 | 56 | 47 |
| 2017 | 52 | 34 |
| 2018 | 39 | 33 |
| 2019 | 30 | 35 |
| 2020 | 39 | 47 |
| 2021 | 27 | 39 |
| 2022 | 31 | 36 |
| 2023 | 27 | 32 |
| 2024 | 30 | 38 |
| 2025 | 23 | 29 |
| 2026 | 20 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- LED lamp assembly with means to conduct heat away from the LEDS470US 6,045,240 ARelume Corporation · 2000
- Thermally protected LED array337US 5,785,418 A1998
- Method for forming elongated solder connections between a semiconductor device and a supporting substrate304US 4,545,610 AInternational Business Machines Corporation · 1985
- Multilayer circuit board manufacturing278US 4,642,160 AInterconnect Technology Inc. · 1987
- Ball-grid-array integrated circuit package with solder-connected thermal conductor174US 5,642,261 ASGS-Thomson Microelectronics S.A. · 1997