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US 12,707,564 B2Granted
Flexible circuit board
AssigneeChipbond Technology Corporation
InventorsTing-Yi Kuo, Yi-Ling Hsieh, Chiu-Hung Lai
Life of this patent
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Abstract
A flexible circuit board includes a flexible substrate, circuit lines, a solder resist layer and shaping strips. The flexible substrate has a first part and a second part which is wider than the first part and easy to be bent. The circuit lines are arranged on the flexible substrate and covered by the solder resist layer. The shaping strips are arranged on the solder resist layer located on the second part and are provided to help to shape the bent second part back to the original one as flat pressing the flexible circuit board.
Claims7
A flexible circuit board comprising:
- a flexible substrate including a first part and a second part which are connected to each other, a first width of the first part is less than a second width of the second part in a first direction;
- a plurality of circuit lines arranged on a surface of the flexible substrate;
- a solder resist layer configured to cover the surface and the plurality of circuit lines;
- and
- plurality of shaping strips arranged on the solder resist layer located on the second part along the first direction, a space exists between the adjacent shaping strips and exposes the solder resist layer, wherein the plurality of shaping strips are extended in a second direction which intersects the first direction,
- wherein the plurality of shaping strips are made of a solder resist material.
3 more elements
Dependencies are inferred from the claim text.