Substrate carrier and motor vehicle
AssigneeHella GmbH & Co. KGaA
InventorMarcus Gattwinkel
Life of this patent
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Abstract
The present invention relates to a substrate carrier for mounting electronic components. The substrate carrier includes: a base body; at least one conductor track; and at least one electronic component. The electronic component is electrically conductively connected to the conductor track by means of at least one solder joint. The base body has at least one relief aperture, the relief aperture being configured to reduce thermal stretching of the solder joint by thermal stretching of the base body. The invention also relates to a motor vehicle including at least one substrate carrier.
Claims15
A substrate carrier for mounting electronic components, the substrate carrier comprising:
- a base body;
- at least one conductor track;
- and
- at least one electronic component, the at least one electronic component being electrically conductively connected to the at least one conductor track via at least one solder joint;
- wherein the base body has at least one relief aperture, the at least one relief aperture being configured to reduce thermal stretching of the at least one solder joint or the last one electronic component by thermal stretching of the base body.
Dependencies are inferred from the claim text.