Flexible circuit board, cof module, and electronic device including same
AssigneeLG Innotek Co., Ltd.
InventorsSung Min CHAE, Ji Hyo PARK, Hyung Kyu YOON
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Abstract
A flexible circuit board according to an embodiment includes a substrate including a first surface and a second surface opposite to the first surface; a first circuit pattern and a second circuit pattern disposed on the first surface; and a metal pattern disposed on the second surface, wherein the second surface includes a plurality of first regions and a plurality of second regions, wherein a first pattern is disposed on the first region, wherein a second pattern is disposed on the second region, and wherein an area of the second pattern is larger than an area of the first pattern.
Claims15
A flexible circuit board comprising:
- a substrate including a first surface and a second surface opposite to the first surface;
- a first circuit pattern and a second circuit pattern disposed on the first surface;
- and
- a metal pattern disposed on the second surface,
- wherein the second surface includes a plurality of first regions and a plurality of second regions,
- wherein the metal pattern includes a first pattern disposed in the first region, and a second pattern disposed in the second region,
- wherein the first pattern includes a plurality of first-first patterns and a plurality of first-second patterns extending in different directions, and
- wherein the metal pattern further includes a connection pattern connected to the plurality of first-first patterns, the plurality of first-second patterns, and the second pattern.
A flexible circuit board comprising:
- a substrate including a first surface including a chip mounting region;
- and a second surface opposite to the first surface;
- a first circuit pattern and a second circuit pattern disposed on the first surface;
- and
- a metal pattern disposed on the second surface,
- wherein the second surface includes a first-first region, a first-second region, and a first-third region,
- wherein the first-third region corresponds to the chip mounting region,
- wherein the metal pattern includes a plurality of first-first patterns and a plurality of first-second patterns disposed on the first-first region, the first-second region, and the first-third region,
- wherein the plurality of first-first patterns and the plurality of first-second patterns extend in different directions, and
- wherein the metal pattern includes a connection pattern connected to the plurality of first-first patterns or the plurality of first-second patterns.
Dependencies are inferred from the claim text.