H05K 2201/09718
Clearance holes
H05K2201/09718 (Clearance holes) appears on 308 US grants and 311 published applications in this corpus.
Search patents in H05K- Granted patents
- 308
- Published applications
- 311
- Assignees
- 152
- Inventors
- 567
- Latest grant
- 17 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 5 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 2 | 0 |
| 2001 | 6 | 2 |
| 2002 | 6 | 3 |
| 2003 | 4 | 9 |
| 2004 | 12 | 19 |
| 2005 | 6 | 20 |
| 2006 | 11 | 30 |
| 2007 | 12 | 23 |
| 2008 | 21 | 26 |
| 2009 | 23 | 35 |
| 2010 | 25 | 27 |
| 2011 | 19 | 17 |
| 2012 | 27 | 17 |
| 2013 | 18 | 12 |
| 2014 | 12 | 12 |
| 2015 | 16 | 8 |
| 2016 | 7 | 6 |
| 2017 | 12 | 3 |
| 2018 | 10 | 7 |
| 2019 | 5 | 2 |
| 2020 | 4 | 5 |
| 2021 | 4 | 7 |
| 2022 | 4 | 4 |
| 2023 | 7 | 9 |
| 2024 | 4 | 4 |
| 2025 | 5 | 1 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Battery apparatus and manufacturing method therefor17 Mar 2026US 12,580,234 B2LG Energy Solution, Ltd.
- Wiring board, semiconductor device, and wiring board manufacturing method30 Dec 2025US 12,513,829 B2Shinko Electric Industries Co., Ltd.
- Printed circuit board, backplane architecture system, and communication device9 Dec 2025US 12,495,484 B2Huawei Technologies Co., Ltd.
- Printed circuit board12 Aug 2025US 12,389,533 B2Zte Corporation
- Mating backplane for high speed, high density electrical connector20 May 2025US 12,309,915 B2Amphenol Corporation
- Printed Circuit board Having Pad and Communication Device5 Mar 2026US 2026/0068034 A1Zte Corporation
- Via hole structure of circuit board, and circuit board26 Feb 2026US 2026/0059652 A1Zte Corporation
- Wiring board, electronic component mounting package including wiring board, and electronic module26 Feb 2026US 2026/0059654 A1KYOCERA Corporation
- Mating backplane for high speed, high density electrical connector6 Nov 2025US 2025/0344316 A1Amphenol Corporation
- Modified internal clearance(s) at connector pin aperture(s) of a circuit board11 Jul 2024US 2024/0237210 A9International Business Machines Corporation
Most cited
By later US patents
- Midplane especially applicable to an orthogonal architecture electronic system215US 7,108,556 B2Amphenol Corporation · 2006
- Differential signal connector with wafer-style construction107US 7,422,483 B2Molex Incorproated · 2008
- Impedance matching stripline transition for microwave signals91US 4,494,083 ATelefonaktiebolaget L M Ericsson · 1985
- Wiring board equipped with a line for transmitting a high frequency signal91US 5,982,256 AKYOCERA Corporation · 1999
- Integrated circuit packaging using flexible substrate87US 5,065,227 AInternational Business Machines Corporation · 1991