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US 12,513,829 B2Granted
Wiring board, semiconductor device, and wiring board manufacturing method
AssigneeShinko Electric Industries Co., Ltd.
InventorMasayuki Mizuno
Life of this patent
Estimating the term…
Abstract
A wiring board includes a first wiring layer, an insulating layer that is arranged on the first wiring layer, and a second wiring layer that is arranged on the insulating layer. The first wiring layer includes a first plain layer, an opening that penetrates through the first plain layer, and a reinforcing pad that is arranged in the opening. The second wiring layer includes a second plain layer. The insulating layer includes a reinforcing via that connects the reinforcing pad and the second plain layer.
Claims10
A wiring board comprising:
- a first wiring layer;
- an insulating layer that is arranged on the first wiring layer;
- and
- a second wiring layer that is arranged on the insulating layer, wherein
- the first wiring layer includes
- a first plain layer;
- a first signal pad;
- a first signal line that is electrically connected to the first signal pad;
- an opening that penetrates through the first plain layer;
- and
- a reinforcing pad that is arranged inside the opening,
- the second wiring layer includes
- a second plain layer:
- a second signal pad;
- and
- a second signal line that is electrically connected to the second signal pad;
- and
- the insulating layer includes
- a reinforcing via that connects the reinforcing pad and the second plain layer;
- and
- a signal via that electrically connects the first signal pad and the second signal pad;
- and
- the reinforcing via and the reinforcing pad do not come into contact with the first signal line and the second signal line.
20 more elements
A semiconductor device comprising:
- a wiring board that includes
- a first wiring layer;
- an insulating layer that is arranged on the first wiring layer;
- and
- a second wiring layer that is arranged on the insulating layer;
- and
- a semiconductor chip that is mounted on the wiring board, wherein
- the first wiring layer includes
- a first plain layer;
- a first signal pad;
- a first signal line that is electrically connected to the first signal pad;
- an opening that penetrates through the first plain layer;
- and
- a reinforcing pad that is arranged inside the opening,
- the second wiring layer includes
- a second plain layer;
- a second signal pad;
- a second signal line that is electrically connected to the second signal pad;
- and
- the insulating layer includes
- a reinforcing via that connects the reinforcing pad and the second plain layer;
- and
- a signal via that electrically connects the first signal pad and the second signal pad;
- and
- the reinforcing via and the reinforcing pad do not come into contact with the first signal line and the second signal line.
22 more elements
A wiring board manufacturing method comprising:
- forming a first wiring layer that includes a first plain layer, a first signal pad, a first signal line that is electrically connected to the first signal pad, an opening that penetrates through the first plain layer, and a reinforcing pad that is arranged inside the opening;
- forming an insulating layer on the first wiring layer;
- forming a through hole that exposes a surface of the reinforcing pad in the insulating layer;
- and
- forming a second wiring layer including a second plain layer, a second signal pad, and a second signal line that is electrically connected to the second signal pad on the insulating layer, wherein
- the forming the second wiring layer includes forming a reinforcing via that connects the reinforcing pad and the second plain layer in the through hole, and a signal via that electrically connects the first signal pad and the second signal pad, wherein the reinforcing via and the reinforcing pad do not come into contact with the first signal line and the second signal line.
3 more elements
Dependencies are inferred from the claim text.