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US 2026/0068034 A1Published application
Printed Circuit board Having Pad and Communication Device
AssigneeZte Corporation
InventorsJianwei HUANG, Zhongmin WEI
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to a printed circuit board having a pad, and a communication device. The printed circuit board comprises: a signal layer and a reference layer, wherein the signal layer is provided with a pad, the pad comprises a stub, the reference layer is provided with a first anti-pad, the vertical projection of the stub in the reference layer is located in a coverage area of the first anti-pad, and the first anti-pad is used for reducing the impedance of the stub.
Claims18
A printed circuit board having a pad, comprising:
- a signal layer and a reference layer;
- wherein the signal layer is provided with a pad, and the pad comprises a stub;
- the reference layer is provided with a first anti-pad, the vertical projection of the stub in the reference layer is located in a coverage area of the first anti-pad, and the first anti-pad is configured to reduce the impedance of the stub.
Dependencies are inferred from the claim text.