Modified internal clearance(s) at connector pin aperture(s) of a circuit board

A computer-implemented method for producing a multilayer circuit board layout, the computer-implemented method comprising:

• producing, using a circuit board design tool, a circuit board layout for a multilayer circuit board being fabricated, the producing comprising:
• identifying, by the circuit board design tool, a layer of the multilayer circuit board with an internal clearance region about an aperture of the multilayer circuit board having a voltage-to-ground clearance of conductive material to be modified;
• determining, by the circuit board design tool, a configuration and orientation of a connector pin to be press-fit connected within the aperture of the multilayer circuit board;
• and
• modifying, by the circuit board design tool, the voltage-to-ground clearance of conductive material in the internal clearance region of the layer about the aperture based on the determined configuration and orientation of the connector pin to be press-fit connected within the aperture of the multilayer circuit board, the voltage-to-ground clearance being modified in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.

A computer system for facilitating producing a multilayer circuit board layout, the computer system comprising:

• a memory;
• and
• at least one processor in communication with the memory, wherein the computer system is configured to perform a method, the method comprising:
• producing, via a circuit board design tool, a circuit board layout for a multilayer circuit board being fabricated, the producing comprising:
• identifying, by the circuit board design tool, a layer of the multilayer circuit board with an internal clearance region about an aperture of the multilayer circuit board having a voltage-to-ground clearance of conductive material to be modified;
• determining, by the circuit board design tool, a configuration and orientation of a connector pin to be press-fit connected within the aperture of the multilayer circuit board;
• and
• modifying, by the circuit board design tool, the voltage-to-ground clearance of conductive material in the internal clearance region of the layer about the aperture based on the determined configuration and orientation of the connector pin to be press-fit connected within the aperture of the multilayer circuit board, the voltage-to-ground clearance being modified in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.

A computer program product for facilitating producing a multilayer circuit board layout, the computer program product comprising:

• one or more computer-readable storage media and program instructions embodied therewith, the program instructions being readable by a processing circuit to cause the processing circuit to perform a method comprising:
• producing, via a circuit board design tool, a circuit board layout for a multilayer circuit board being fabricated, the producing comprising:
• identifying, by the circuit board design tool, a layer of the multilayer circuit board with an internal clearance region about an aperture of the multilayer circuit board having a voltage-to-ground clearance of conductive material to be modified;
• determining, by the circuit board design tool, a configuration and orientation of a connector pin to be press-fit connected within the aperture of the multilayer circuit board;
• and
• modifying, by the circuit board design tool, the voltage-to-ground clearance of conductive material in the internal clearance region of the layer about the aperture based on the determined configuration and orientation of the connector pin to be press-fit connected within the aperture of the multilayer circuit board, the voltage-to-ground clearance being modified in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.