H05K 2201/09763
Printed component having superposed conductors, but integrated in one circuit layer
H05K2201/09763 (Printed component having superposed conductors, but integrated in one circuit layer) appears on 176 US grants and 201 published applications in this corpus.
Search patents in H05K- Granted patents
- 176
- Published applications
- 201
- Assignees
- 99
- Inventors
- 374
- Latest grant
- 12 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 6 | 0 |
| 1999 | 6 | 0 |
| 2000 | 1 | 0 |
| 2001 | 4 | 2 |
| 2002 | 3 | 6 |
| 2003 | 5 | 7 |
| 2004 | 3 | 13 |
| 2005 | 8 | 17 |
| 2006 | 10 | 31 |
| 2007 | 9 | 28 |
| 2008 | 15 | 19 |
| 2009 | 12 | 18 |
| 2010 | 16 | 17 |
| 2011 | 12 | 8 |
| 2012 | 12 | 6 |
| 2013 | 13 | 3 |
| 2014 | 5 | 0 |
| 2015 | 1 | 4 |
| 2016 | 0 | 1 |
| 2017 | 2 | 5 |
| 2018 | 5 | 3 |
| 2019 | 5 | 3 |
| 2020 | 2 | 3 |
| 2021 | 3 | 1 |
| 2022 | 1 | 3 |
| 2023 | 0 | 1 |
| 2024 | 2 | 2 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Method of making a stacked electronic component12 Aug 2025US 12,389,544 B2X-Celeprint Limited
- Stretchable wiring board and device with adhesive patch for living body23 Jul 2024US 12,048,091 B2Murata Manufacturing Co., Ltd.
- Printed circuit board, inverter, motor vehicle and method for producing a printed circuit board9 Apr 2024US 11,956,895 B2ZF Friedrichshafen AG
- Printed stacked micro-devices1 Nov 2022US 11,490,519 B2X-Celeprint Limited
- Modulated inductance module14 Dec 2021US 11,201,007 B2
- High performance capacitors and current path arrangements1 Aug 2024US 2024/0258034 A1Resonant Link, Inc.
- Integrated passive device with via formed in isolation trench28 Mar 2024US 2024/0105586 A1Saras Mirco Devices, Inc.
- Printed stacked micro-devices19 Jan 2023US 2023/0017617 A1X-Celeprint Limited
- Stretchable wiring board and device with adhesive patch for living body29 Sep 2022US 2022/0312587 A1Murata Manufacturing Co., Ltd.
- Printed stacked micro-devices14 Jul 2022US 2022/0225508 A1X-Celeprint Limited
Most cited
By later US patents
- Flexible interconnect film including resistor and capacitor layers289US 5,874,770 AGeneral Electric Company · 1999
- Injection molded printed circuits132US 5,220,488 AUFE Incorporated · 1993
- Capacitive chip carrier and multilayer ceramic capacitors124US 4,349,862 AInternational Business Machines Corporation · 1982
- Power core devices124US 7,701,052 B2E. I. Du Pont de Nemours and Company · 2010
- Interposer87US 7,589,394 B2Ibiden Co., Ltd. · 2009