H05K 2201/09772
Conductors directly under a component but not electrically connected to the component
H05K2201/09772 (Conductors directly under a component but not electrically connected to the component) appears on 125 US grants and 101 published applications in this corpus.
Search patents in H05K- Granted patents
- 125
- Published applications
- 101
- Assignees
- 103
- Inventors
- 306
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 3 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 5 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 2 | 1 |
| 2002 | 2 | 4 |
| 2003 | 4 | 5 |
| 2004 | 2 | 7 |
| 2005 | 4 | 7 |
| 2006 | 4 | 7 |
| 2007 | 7 | 10 |
| 2008 | 4 | 7 |
| 2009 | 3 | 5 |
| 2010 | 10 | 6 |
| 2011 | 3 | 5 |
| 2012 | 5 | 5 |
| 2013 | 3 | 1 |
| 2014 | 5 | 2 |
| 2015 | 3 | 2 |
| 2016 | 1 | 0 |
| 2017 | 2 | 3 |
| 2018 | 1 | 1 |
| 2019 | 1 | 2 |
| 2020 | 4 | 3 |
| 2021 | 2 | 5 |
| 2022 | 5 | 2 |
| 2023 | 1 | 4 |
| 2024 | 3 | 1 |
| 2025 | 3 | 1 |
| 2026 | 1 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor substrate including first and second conductive posts and a plurality of first and second circuit layer pads26 May 2026US 12,642,109 B2Advanced Semiconductor Engineering, Inc.
- Stretchable mounting substrate15 Jul 2025US 12,363,823 B2Murata Manufacturing Co., Ltd.
- Temperature measurement module and power storage module11 Mar 2025US 12,249,697 B2Autonetworks Technologies, Ltd.
- Flexible LED strip21 Jan 2025US 12,203,613 B1
- Method for producing a panel with integrated electronics3 Dec 2024US 12,160,094 B2Airbus SAS
- Semiconductor substrate including first and second conductive posts and a plurality of first and second circuit layer pads10 Sep 2026US 2026/0271754 A1Advanced Semiconductor Engineering, Inc.
- Flexible circuit board, cof module, and electronic device including same30 Jul 2026US 2026/0223284 A1LG Innotek Co., Ltd.
- Display device and display panel2 Jul 2026US 2026/0190692 A1LG Display Co., Ltd.
- Power modules with enhanced thermal conductivity11 Jun 2026US 2026/0164537 A1Analog Devices, Inc.
- Printed circuit board heat exchanger and associated method19 Feb 2026US 2026/0052621 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Surface mounted multilayer memory printed circuit board98US 4,891,789 ABull HN Information Systems Inc. · 1990
- Printed circuit board for reducing noise96US 5,488,540 ANippondenso Co., Ltd. · 1996
- Internally shielded energy conditioner80US 7,675,729 B2X2Y Attenuators, LLC · 2010
- Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die pad73US 6,849,944 B2Texas Instruments Incorporated · 2005
- Semiconductor device and resin structure therefor70US 7,476,975 B2Seiko Epson Corporation · 2009