Semiconductor substrate including first and second conductive posts and a plurality of first and second circuit layer pads

A semiconductor package, comprising:

• a first dielectric layer having a first surface and a second surface that are opposite to each other;
• a first circuit layer embedded in the first dielectric layer, wherein the first circuit layer comprises at least one first circuit layer pad and at least one second circuit layer pad;
• a substrate defining at least one hole that expose the first circuit layer;
• at least one first conductive post disposed in the at least one hole of the substrate;
• a solder disposed over the at least one first conductive post;
• a second conductive post extending along a direction from the second surface of the first dielectric layer toward the first surface of the first dielectric layer and contacting the first circuit layer, wherein the at least one first circuit layer pad is electrically connected to the at least one first conductive post, and the at least one second circuit layer pad is electrically connected to the at least one second conductive post.

A semiconductor package, comprising:

• a first dielectric layer having a first surface and a second surface that are opposite to each other;
• a first circuit layer embedded in the first dielectric layer, wherein the first circuit layer comprises a first circuit layer pad and a second circuit layer pad;
• a first conductive post disposed over the first circuit layer;
• a reinforcing layer disposed above the first conductive post;
• and
• a second conductive post extending along a direction from the second surface of the first dielectric layer toward the first surface of the first dielectric layer and contacting the first circuit layer,
• wherein the first circuit layer pad is electrically connected to the first conductive post, and the second circuit layer pad is electrically connected to the second conductive post.