Printed circuit board for reducing noise

A printed circuit board comprising:

• a substrate including first and second base layers;
• a first conductive pattern block formed on a surface of the first base layer of said substrate to connect with a power terminal of an IC mounted on an opposite surface of the first base layer;
• a second conductive pattern block formed on the second base layer to connect with a grounding terminal of the IC;
• a power conductor arranged horizontally to one of said first and second conductive pattern blocks at a preselected interval therebetween;
• a grounding conductor arranged horizontally to the other of said first and second conductive pattern blocks at a preselected interval therebetween;
• a first noise-reducing filter provided adjacent the IC, said first noise-reducing filter having a terminal which extends through a thickness of the first base layer to connect with said first conductive pattern block for reducing noise concentrated on said first conductive pattern block;
• and
• a second noise-reducing filter provided adjacent the IC, said second noise-reducing filter having a terminal which extends through thicknesses of the first and second base layers to connect with said second conductive pattern block for reducing noise concentrated on said second conductive pattern block.

A printed circuit board adapted for connection with an IC via a plurality of IC mounting terminals including at least an IC power terminal and an IC ground terminal, said printed circuit board comprising:

• first and second insulating base layers, said first insulating base layer providing an IC mounting area over which an IC can be mounted;
• first and second mounting conductors formed on said second insulating base layer and adapted to be connected with the IC power terminal and the IC ground terminal, respectively;
• first and second conductive pattern blocks both having a generally square shape, said first conductive pattern block being arranged between said first and second insulating base layers at a location overlapping with said IC mounting area, said first conductive pattern block being electrically connected with said first mounting conductor, said second conductive pattern block being disposed adjacent said second insulating base layer on a side of said second insulating base layer opposite a side on which the first conductive pattern block is disposed at a location overlapping with the IC mounting area, said second conductive pattern block being electrically connected with said second mounting conductor;
• first and second common conductors, said first common conductor being arranged between said first and second insulating base layers, said second common conductor being disposed on a side of the second insulating base layer opposite a side on which the first common conductor is disposed, the first common conductor adapted to be connected with the IC power terminal through said first conductive pattern block and said first mounting conductor, the second common conductor adapted to be connected with the IC ground terminal through said second conductive pattern block and said second mounting conductor;
• and
• first and second noise-reducing elements, said first noise-reducing element being electrically connected between said first conductive pattern block and said first common conductor to reduce noise transmitted from said first conductive pattern block to said first common conductor, said second noise-reducing element being electrically connected between said second conductive pattern block and said second common conductor to reduce noise transmitted from said second conductive pattern block to said second common conductor.

A printed circuit board adapted for connection with an IC via a plurality of IC mounting terminals including at least an IC power terminal and an IC ground terminal, said printed circuit board comprising:

• an IC mounting area over which an IC can be mounted;
• mounting conductors adapted to be connected with the IC mounting terminals;
• a common conductor assembly including a power conductor and a grounding conductor;
• a conductive pattern block assembly including first and second conductive pattern blocks disposed in overlapping relation with the IC mounting area, said conductive pattern block assembly being electrically connected with said common conductor assembly solely through at least one predetermine electrical path, said first conductive pattern block adapted to be electrically connected with the IC power terminal through a first portion of said mounting conductors, said second conductive pattern block adapted to be connected with the IC ground terminal through a second portion of said mounting conductors,
• said first and second conductive pattern blocks being disposed in spaced relation with respect to the power conductor and the grounding conductor, respectively, for preventing noise concentrated on the first and second conductive pattern blocks from being transmitted to the power and grounding conductors, respectively;
• and
• a noise-reducing element provided within said at least one predetermined electrical path for reducing noise transmitted from said conductive pattern block assembly to said common conductor assembly.