Printed circuit board heat exchanger and associated method

A method of manufacturing a printed circuit board, the method comprising:

• forming a stack comprising a core layer, a plurality of prepreg layers, and a plurality of electrically conducting layers for carrying electrical signals and/or for providing a ground plane;
• forming a first heat conducting layer within the stack such that the first heat conducting layer receives heat dissipated from one or more components attached to a surface of the printed circuit board and such that the first heat conducting layer is electrically isolated from all of the plurality of electrically conducting layers;
• forming a second heat conducting layer within the stack on an opposite side of one of the plurality of electrically conducting layers from the first heat conducting layer and such that the second heat conducting layer is electrically isolated from all of the plurality of electrically conducting layers;
• and
• forming a first plurality of heat conducting vias connected between the first heat conducting layer and the second heat conducting layer, such that each of the first plurality of heat conducting vias are electrically isolated from all of the plurality of electrically conducting layers.

A photonic sensor comprising:

• a printed circuit board (PCB) having a light producing component mounted thereto, the PCB comprising:
• a core layer;
• a plurality of prepreg layers;
• a plurality of electrically conducting layers for carrying electrical signals and/or for providing a ground plane;
• a first heat conducting layer positioned to receive heat dissipated from the light producing component, the first heat conducting layer being electrically isolated from all of the plurality of electrically conducting layers;
• a second heat conducting layer positioned on an opposite side of one of the plurality of electrically conducting layers from the first heat conducting layer, the second heat conducting layer being electrically isolated from all of the plurality of electrically conducting layers;
• and
• a first plurality of heat conducting vias, each of the first plurality of heat conducting vias connected between the first heat conducting layer and the second heat conducting layer, each of the first plurality of heat conducting vias being electrically isolated from all of the plurality of electrically conducting layers.