Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die pad

A method for forming an integrated circuit package, comprising:

• providing a die pad to be used in said integrated circuit package having a top surface;
• coupling at least two bump pad traces to the lop surface of the die pad;
• coupling each of a plurality of traces to the top surface of the die pad in a corresponding inter-bump pad region between adjacent bump pad traces;
• coupling a die associated with an integrated circuit to the die pad using a plurality of solder bumps, each coupling the die to the die pad at a corresponding bump pad trace, to provide electrical connectivity between circuitry associated with the die and circuitry associated with the die pad;
• reflowing the solder bumps to bond the solder bumps to the die and to the corresponding bump pad traces;
• and
• substantially preventing collapse of the die towards the die pad during the reflow process using a supporting structure that contacts the die during the reflow process, the supporting structure being used instead of depositing any solder mask material in at least one inter-bump pad region to control the collapse of the die towards the die pad during the reflow process.

A method for controlling collapse of a die towards a die pad during a reflow process for coupling the die to the die pad, comprising:

• providing the die pad having a top surface;
• coupling at least two bump pad traces to the top surface of the die pad;
• coupling each of a plurality of traces to the top surface of the die pad in a corresponding inter-bump pad region between adjacent bump pad traces;
• coupling the die associated with an integrated circuit to the die pad using a plurality of solder bumps, each coupling the die to the die pad at a corresponding bump pad trace, to provide electrical connectivity between circuitry associated with the die and circuitry associated with the die pad;
• reflowing the solder bumps to bond the solder bumps to the die and to the corresponding bump pad traces;
• and
• substantially preventing collapse of the die towards the die pad during the reflow process using a supporting structure that contacts the die during the reflow process, the supporting structure being used instead of depositing any solder mask material in the inter-bump pad region to control the collapse of the die towards the die pad during the reflow process.

A flip chip assembly, comprising:

• a die associated with an integrated circuit, the die having a bottom surface;
• a die pad having a top surface opposite the bottom surface of the die;
• at least two bump pad traces each coupled to the top surface of the die pad;
• a plurality of traces each coupled to the top surface of the die pad in a corresponding inter-bump pad region between adjacent bump pad traces;
• and
• a plurality of solder bumps each coupling the die to the die pad at a corresponding bump pad trace to provide electrical connectivity between circuitry associated with the die and circuitry associated with the die pad;
• each inter-bump pad region being free from any solder mask material deposited to control collapse of the die towards the die pad during a reflow process, the reflow process comprising a thermal process for bonding the die to the die pad using the solder bumps, a plurality of posts near each corner region of the die that contact the die during the reflow process having been used instead to substantially prevent collapse of the die towards the die pad the plurality of posts coupled to a tray, the tray underlying and supporting the die pad during the reflow process, each post extending through the top surface of the die pad in the inter-bump pad region and contacting the bottom surface of the die during the reflow process.