H05K 2201/09745
Recess in conductor
Official title: Recess in conductor, e.g. in pad or in metallic substrate
H05K2201/09745 (Recess in conductor) appears on 498 US grants and 495 published applications in this corpus.
Search patents in H05K- Granted patents
- 498
- Published applications
- 495
- Assignees
- 263
- Inventors
- 1,136
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 7 | 0 |
| 1996 | 6 | 0 |
| 1997 | 3 | 0 |
| 1998 | 8 | 0 |
| 1999 | 8 | 0 |
| 2000 | 10 | 0 |
| 2001 | 15 | 3 |
| 2002 | 17 | 7 |
| 2003 | 23 | 17 |
| 2004 | 6 | 26 |
| 2005 | 17 | 27 |
| 2006 | 18 | 31 |
| 2007 | 19 | 27 |
| 2008 | 30 | 50 |
| 2009 | 20 | 37 |
| 2010 | 27 | 28 |
| 2011 | 26 | 24 |
| 2012 | 32 | 20 |
| 2013 | 19 | 18 |
| 2014 | 14 | 22 |
| 2015 | 17 | 22 |
| 2016 | 16 | 15 |
| 2017 | 11 | 12 |
| 2018 | 10 | 14 |
| 2019 | 17 | 5 |
| 2020 | 6 | 18 |
| 2021 | 11 | 17 |
| 2022 | 16 | 12 |
| 2023 | 11 | 15 |
| 2024 | 12 | 15 |
| 2025 | 10 | 7 |
| 2026 | 9 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring circuit board and wiring circuit board assembly sheet25 Aug 2026US 12,720,677 B2Nitto Denko Corporation
- Bulb-type light source18 Aug 2026US 12,710,143 B2Seoul Semiconductor Co., Ltd.
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Leadframe mounting with lead insertion for lead wall bonding9 Jun 2026US 12,652,759 B2Semiconductor Components Industries, LLC
- Electronic circuit assemblies, methods of manufacturing the same, and modules28 Apr 2026US 12,615,719 B2Pragmatic Semiconductor Limited
- Component Carrier and Method of Manufacturing the Same13 Aug 2026US 2026/0239535 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Circuit board6 Aug 2026US 2026/0231325 A1
- Wiring Circuit Board and Wiring Circuit Board Manufacturing Method25 Jun 2026US 2026/0181783 A1Nitto Denko Corporation
- Circuit substrate having improved bonding structure18 Jun 2026US 2026/0173266 A1Tong Hsing Electronic Industries, Ltd.
- Offset-chip embedded circuit board and manufacturing method therefor11 Jun 2026US 2026/0165169 A1ZF Friedrichshafen AG
Most cited
By later US patents
- Solder ball land metal structure of ball grid semiconductor package176US 5,872,399 AAmkor Technology, Inc. · 1999
- Connection of trace circuitry in a computer disk drive system163US 7,059,868 B1Western Digital (Fremont), LLC · 2006
- Pad grid array for receiving a solder bumped chip carrier132US 4,940,181 AMotorola, Inc. · 1990
- Packaging power converters128US 5,973,923 A1999
- Shaped, self-aligning micro-bump structures123US 5,477,086 ALSI Logic Corporation · 1995