Wiring Circuit Board and Wiring Circuit Board Manufacturing Method

A wiring circuit board including a wiring structure layer having an insulating layer and a wiring layer, and a metal reinforcing layer in contact with one surface of the wiring structure layer, wherein

• a surface of the metal reinforcing layer on a side opposite to the wiring structure layer side is exposed,
• the metal reinforcing layer has an opening for enabling a semiconductor chip to be connected to the wiring circuit board, the opening penetrating the metal reinforcing layer in a thickness direction, and
• in a case where, in a cross section in the thickness direction of the metal reinforcing layer, which includes the opening,
• a line which is a surface of the metal reinforcing layer on a side opposite to the wiring structure layer side is defined as a line (A),
• a line which is a surface of the metal reinforcing layer on the wiring structure layer side is defined as a line (B),
• an intersection of one side line of two side lines included in a shape of the opening and the line (A) is defined as an intersection (a), an intersection of the one side line and the line (B) is defined as an intersection (b),
• a line connecting the intersection (a) and the intersection (b) is defined as a line segment (C), and
• a line of the line (B) on a side opposite to the opening side with the intersection (b) as a start point is defined as a half line (BH),
• an angle (α) formed by the half line (BH) and the line segment (C) is less than 90°.