Offset-chip embedded circuit board and manufacturing method therefor

A manufacturing method for manufacturing an offset-chip embedded circuit board, the manufacturing method comprising:

• forming a slot in a core;
• embedding a chip packaging unit in the slot, the chip packaging unit comprising a conductive substrate and a chip unit embedded in the conductive substrate, wherein the chip unit is offset on a side of the conductive substrate, and an electrode lead-out area of the chip unit is reserved on an other side of the conductive substrate;
• stacking a prepreg and a conductive layer on the core;
• drilling the conductive layer and the prepreg to form vias that penetrate the conductive layer and the prepreg and that communicate with lead-out areas of electrodes of the chip unit;
• and
• filling a conductive material into the vias to form lead-out wires that are led out from a front side of the chip packaging unit and arranged in the prepreg and the conductive layer.