Leadframe mounting with lead insertion for lead wall bonding
AssigneeSemiconductor Components Industries, LLC
InventorsChad Chen, Jiahui Liu, Wuxing Xia, Jingyan Liu
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Abstract
A semiconductor device package may include a substrate having an insulating layer with a patterned conductive layer formed thereon, the patterned conductive layer including at least a first pattern portion and a second pattern portion. The semiconductor device package may include a leadframe having a lead that is soldered to the substrate with solder provided in an opening between the first pattern portion and the second pattern portion and with the lead inserted into the opening.
Claims20
A method of making a semiconductor device package, comprising:
- patterning a patterned conductive layer on an insulating layer of a substrate, the patterned conductive layer including at least a first pattern portion and a second pattern portion;
- applying solder paste within an opening between the first pattern portion and the second pattern portion and at least partially on the insulating layer;
- positioning a leadframe on the patterned conductive layer;
- inserting a lead of the leadframe within the solder paste;
- and
- heating the solder paste to solder bond the lead to the first pattern portion and the second pattern portion on the substrate with the lead inserted into the opening.
A method of making a semiconductor device package, comprising:
- forming a substrate having an insulating layer with a patterned conductive layer formed thereon, the patterned conductive layer including at least a first pattern portion and a second pattern portion;
- and
- providing a leadframe on the patterned conductive layer with a lead that is soldered to the first pattern portion and the second pattern portion on the substrate with solder provided at least partially on the insulating layer in an opening between the first pattern portion and the second pattern portion and with the lead inserted into the opening.
A method of making a semiconductor device package, comprising:
- forming a substrate having an insulating layer with a patterned conductive layer formed thereon, the patterned conductive layer including at least a first pattern portion and a second pattern portion;
- and
- forming a leadframe positioned on the patterned conductive layer and having a lead with a lead end portion that is inserted into an opening between the first pattern portion and the second pattern portion, and that is soldered to at least one wall of the opening and to the insulating layer.
Dependencies are inferred from the claim text.