Waveguide interface for coupling a waveguide to a microwave conductor on a PCB and including a backshort dielectric being the same as a dielectric of the PCB

A method for configuring a waveguide interface arrangement used for electrically connecting a waveguide device to a microwave conductor in a printed circuit board (PCB), where the PCB including a PCB dielectric layer with a first PCB main side and a second PCB main side, where the first PCB main side is used for attachment of a waveguide device, where the method comprises:

• providing a first PCB metallization at the first PCB main side and a first PCB aperture in the first PCB metallization, where the first PCB aperture is adapted to correspond to a waveguide aperture of the waveguide device;
• providing a second PCB metallization at the second PCB main side and a second PCB aperture in the second PCB metallization;
• mounting at least one electronic component to the first PCB metallization;
• providing a backshort having a backshort dielectric layer with a first backshort main side and a second backshort main side;
• providing a first backshort metallization at the first backshort main side;
• and
• providing a second backshort metallization at the second backshort main side and a second backshort aperture in the second backshort metallization;
• where the first and second backshort metallizations are electrically connected to each other, and the first backshort metallization covers a main part of the first backshort main side, where the method further comprises
• attaching the backshort to the second PCB main side such that the second backshort metallization is electrically connected to the second PCB metallization, and such that the second backshort aperture is adapted to face the second PCB aperture, wherein the PCB dielectric layer and the backshort dielectric layer are made of same material to reduce thermal mismatches in the waveguide interface arrangement.