H05K 2201/098
Special shape of the cross-section of conductors
Official title: Special shape of the cross-section of conductors, e.g. very thick plated conductors
H05K2201/098 (Special shape of the cross-section of conductors) appears on 246 US grants and 275 published applications in this corpus.
Search patents in H05K- Granted patents
- 246
- Published applications
- 275
- Assignees
- 158
- Inventors
- 680
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 6 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 6 | 2 |
| 2002 | 8 | 9 |
| 2003 | 5 | 10 |
| 2004 | 12 | 11 |
| 2005 | 5 | 10 |
| 2006 | 4 | 10 |
| 2007 | 7 | 12 |
| 2008 | 3 | 11 |
| 2009 | 7 | 14 |
| 2010 | 11 | 9 |
| 2011 | 8 | 6 |
| 2012 | 11 | 6 |
| 2013 | 11 | 8 |
| 2014 | 3 | 7 |
| 2015 | 5 | 16 |
| 2016 | 7 | 15 |
| 2017 | 14 | 14 |
| 2018 | 9 | 7 |
| 2019 | 14 | 13 |
| 2020 | 10 | 17 |
| 2021 | 14 | 16 |
| 2022 | 12 | 14 |
| 2023 | 11 | 11 |
| 2024 | 9 | 7 |
| 2025 | 11 | 11 |
| 2026 | 1 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Arrangement for a semiconductor arrangement comprising at least one passive component and a substrate25 Nov 2025US 12,482,739 B2Siemens Aktiengesellschaft
- Printed circuit board and method for manufacturing the same14 Oct 2025US 12,446,163 B2Samsung Electro-Mechanics Co., Ltd.
- Circuit board and method of manufacturing circuit board16 Sep 2025US 12,418,977 B2Murata Manufacturing Co., Ltd.
- Resin multilayer substrate and method for manufacturing resin multilayer substrate2 Sep 2025US 12,403,673 B2Murata Manufacturing Co., Ltd.
- Electronic device20 Aug 2026US 2026/0247531 A1InnoCare Optoelectronics Corporation
- Transition from a thin film to a thick film in electrically conducting devices16 Jul 2026US 2026/0206131 A1Dyconex AG
- Component Carrier with Different Line Spacing in Metal Traces, and Manufacture Method9 Jul 2026US 2026/0197938 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wiring circuit board11 Jun 2026US 2026/0164544 A1Nitto Denko Corporation
- Component Carrier With Embedded Trace Having Lateral Walls Slanted Inwardly Beginning From an Exterior Surface And Having An Opposing Rounded Edge14 May 2026US 2026/0136969 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- Microstrip arrangement220US 6,266,016 B1Telefonaktiebolaget LM Ericsson (publ) · 2001
- Methods of producing a composite substrate78US 7,487,587 B2Interuniversitair Microelektronica Centrum vzw (IMEC) · 2009
- Composite substrate67US 8,431,828 B2Imec · 2013
- Copper circuit junction substrate and method of producing the same49US 6,261,703 B1Sumitomo Electric Industries, Ltd. · 2001
- Planar coil and planar transformer, and process of fabricating a high-aspect conductive device48US 6,600,404 B1TDK Corporation · 2003