Arrangement for a semiconductor arrangement comprising at least one passive component and a substrate

A method for producing an arrangement for a semiconductor arrangement, the method comprising:

• providing a passive component with a first profile having a protrusion and a connection arranged on a side of the protrusion facing away from the dielectric material laver;
• forming a substrate with a dielectric material layer and a first metallization which is arranged on the dielectric material layer and includes a second profile having a recess;
• arranging the passive component completely in a cutout of the first metallization, such that the passive component bears directly on the dielectric material layer;
• and
• engaging the first profile protrusion and the second profile recess with one another and the connection connecting the passive component to the first metallization.