Component Carrier With Embedded Trace Having Lateral Walls Slanted Inwardly Beginning From an Exterior Surface And Having An Opposing Rounded Edge

A method of manufacturing a component carrier, the method comprising:

• forming a stack comprising at least one electrically insulating layer structure and at least one electrically conductive layer structure;
• forming the at least one electrically conductive layer structure with at least one trace embedded in the at least one electrically insulating layer structure;
• configuring the at least one trace so that it comprises, in a cross section, two lateral walls slanted inwardly beginning from an exterior surface where the embedded trace is exposed with respect to the at least one electrically insulating layer structure;
• and
• configuring the at least one trace so that it comprises, in the cross section, two sharp edges at the exterior surface and at least one rounded edge at an opposed extremity.