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US 12,707,560 B2Granted
Wiring substrate and method for manufacturing the same
AssigneeIbiden Co., Ltd.
InventorsShunsuke Sakai, Koji Okabe
Life of this patent
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Abstract
A wiring substrate includes a substrate, and a conductor layer formed on the substrate and including copper such that the conductor layer is patterned. The conductor layer is formed such that the upper surface of the conductor layer has a width that is equal to or larger than a width of the lower surface of the conductor layer and that the width of the lower surface is larger than the minimum width of a middle portion of the conductor layer between the upper surface and the lower surface.
Claims16
A wiring substrate, comprising:
- a substrate;
- and
- a plurality of high-density wiring patterns formed on the substrate and comprising copper such that the high-density wiring patterns have upper surfaces that are not in contact with each other and that adjacent high-density wiring patterns have an inter-wiring distance determined based on widths of the upper surfaces of the adjacent high-density wiring patterns,
- wherein the plurality of high-density wiring patterns is formed such that the upper surface of each of the high-density wiring patterns has a width that is larger than a width of a lower surface of each of the high-density wiring patterns, that a ratio, the width of the upper surface/the width of the lower surface, is smaller than 1.15 and that the width of the lower surface is larger than a minimum width of a middle portion of each of the high-density wiring patterns between the upper surface and the lower surface.
1 more element
Dependencies are inferred from the claim text.