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US 12,446,163 B2Granted
Printed circuit board and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMo Ses Cho, Chang Gun Oh, Je Sang Park
Life of this patent
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Abstract
A printed circuit board includes: a first insulating layer; a circuit pattern protruding from an upper surface of the first insulating layer and having recesses in side surfaces thereof; and a metal portion covering an upper surface and each of both side surfaces of the circuit pattern. The first insulating layer is spaced apart from at least a portion of a lower surface of the circuit pattern.
Claims16
A printed circuit board comprising:
- a first insulating layer;
- a circuit pattern protruding from an upper surface of the first insulating layer in a thickness direction and having recesses in side surfaces thereof;
- and
- a metal portion covering an upper surface and at least a portion of each of the side surfaces of the circuit pattern,
- wherein the recesses are thinner than a portion of the circuit pattern extending from the recesses in the thickness direction,
- wherein at least a portion of the side surfaces extend inwardly from the upper surface of the first insulating layer to a lower surface of the circuit pattern arranged between the upper surface of the circuit pattern and the at least a portion of the side surfaces in the thickness direction, and
- wherein a thickness of the at least a portion of the side surfaces is less than a thickness of a remaining portion of the circuit pattern above the lower surface of the circuit pattern.
4 more elements
A printed circuit board comprising:
- a first insulating layer;
- a circuit pattern disposed on the first insulating layer and having a recess in a side surface thereof;
- and
- a metal portion including a metal different from that of the circuit pattern and covering an upper surface and a side surface of the circuit pattern,
- wherein a part of the metal portion covering the side surface of the circuit pattern includes a lower portion which is spaced apart from the first insulating layer by at least a distance corresponding to a thickness of the recess,
- wherein a portion of the side surface extends inwardly from the first insulating layer to a lower surface of the circuit pattern arranged between the upper surface of the circuit pattern and the portion of the side surface in a thickness direction, and
- wherein a thickness of the portion of the side surface is less than a thickness of a remaining portion of the circuit pattern above the lower surface of the circuit pattern.
4 more elements
Dependencies are inferred from the claim text.