Circuit board and method of manufacturing circuit board

A circuit board comprising:

• a substrate body including one or more insulator layers, an upper principal surface, and a lower principal surface with a normal line extending in an up-down direction;
• and
• a plurality of conductor layers in or on the substrate body;
• wherein
• the plurality of conductor layers include one or more pairs of a first conductor layer and a second conductor layer provided on one of the one or more insulator layers;
• each of the one or more pairs of the first conductor layer and the second conductor layer includes a first proximity section in which the first conductor layer and the second conductor layer are aligned in an orthogonal direction orthogonal or substantially orthogonal to an extending direction of the first conductor layer;
• a distance between the first conductor layer and the second conductor layer in the first proximity section is defined as a proximity distance;
• the one or more insulator layers includes a first insulator layer;
• a most proximate first conductor layer and a most proximate second conductor layer are defined as the first and second conductor layers with a smallest proximity distance and are located on an upper principal surface of the first insulator layer;
• the most proximate first conductor layer includes a first side surface and a second side surface aligned in the orthogonal direction;
• the most proximate second conductor layer includes a third side surface and a fourth side surface aligned in the orthogonal direction;
• the first side surface and the third side surface face each other;
• and
• a first acute angle between the first side surface and the upper principal surface of the first insulator layer is larger than a second acute angle between the second side surface and the upper principal surface of the first insulator layer.