H05K 2201/0969
Apertured conductors
H05K2201/0969 (Apertured conductors) appears on 710 US grants and 735 published applications in this corpus.
Search patents in H05K- Granted patents
- 710
- Published applications
- 735
- Assignees
- 325
- Inventors
- 1,571
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 7 | 0 |
| 1995 | 6 | 0 |
| 1996 | 7 | 0 |
| 1997 | 3 | 0 |
| 1998 | 13 | 0 |
| 1999 | 6 | 0 |
| 2000 | 8 | 0 |
| 2001 | 14 | 7 |
| 2002 | 22 | 22 |
| 2003 | 30 | 36 |
| 2004 | 26 | 23 |
| 2005 | 25 | 53 |
| 2006 | 28 | 57 |
| 2007 | 30 | 54 |
| 2008 | 37 | 53 |
| 2009 | 35 | 62 |
| 2010 | 41 | 46 |
| 2011 | 37 | 32 |
| 2012 | 42 | 23 |
| 2013 | 30 | 42 |
| 2014 | 31 | 40 |
| 2015 | 31 | 30 |
| 2016 | 27 | 20 |
| 2017 | 30 | 19 |
| 2018 | 18 | 11 |
| 2019 | 22 | 12 |
| 2020 | 17 | 21 |
| 2021 | 14 | 16 |
| 2022 | 17 | 18 |
| 2023 | 17 | 15 |
| 2024 | 8 | 15 |
| 2025 | 14 | 4 |
| 2026 | 4 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Waveguide interface for coupling a waveguide to a microwave conductor on a PCB and including a backshort dielectric being the same as a dielectric of the PCB22 Sep 2026US 12,744,296 B2Telefonaktiebolaget LM Ericsson (publ)
- Structurally enhanced filtering of circuit board planes18 Aug 2026US 12,713,518 B2Microsoft Technology Licensing, LLC
- Wiring board and method for manufacturing wiring board31 Mar 2026US 12,593,395 B2Dai Nippon Printing Co.Ltd.
- Circuit board and electronic device24 Feb 2026US 12,563,662 B2Honor Device Co., Ltd.
- Electronic module, imaging unit and equipment16 Sep 2025US 12,418,975 B2Canon Kabushiki Kaisha
- Wiring board and method for manufacturing wiring board13 Aug 2026US 2026/0239527 A1Dai Nippon Printing Co.Ltd.
- Electronic chip packaging11 Jun 2026US 2026/0165178 A1STMicroelectronics International N. V.
- Printed Circuit board Having Pad and Communication Device5 Mar 2026US 2026/0068034 A1Zte Corporation
- Wiring substrate and wiring member8 Jan 2026US 2026/0013038 A1Shanghai AVIC Optoelectronics Co., Ltd.
- Vertical conductive structure transition impedance optimization4 Sep 2025US 2025/0280493 A1International Business Machines Corporation
Most cited
By later US patents
- Semiconductor device with a film carrier tape197US 5,668,405 ANEC Corporation · 1997
- Solder ball land metal structure of ball grid semiconductor package176US 5,872,399 AAmkor Technology, Inc. · 1999
- Disk drive comprising stacked and stepped traces for improved transmission line performance165US 8,289,656 B1Western Digital Technologies, Inc. · 2012
- Card-type electronic device with plastic frame sandwiched between printed circuit boarding metal panel150US 5,784,259 ASeiko Epson Corporation · 1998
- Card-type electronic device with plastic frame sandwiched between printed circuit board and metal panel137US 5,742,479 ASeiko Epson Corporation · 1998