Electronic module, imaging unit and equipment

An electronic module comprising:

• a flexible printed circuit board having a first electrode group;
• a printed wiring board having a second electrode group;
• and
• an electronic component mounted on the printed wiring board,
• wherein the printed wiring board includes a first conductive layer formed to include the second electrode group and a second conductive layer formed under the first conductive layer,
• wherein the first electrode group and the second electrode group are bonded by solder,
• wherein a plane including the second conductive layer includes a first region, a second region in contact with the first region via a first boundary, and a third region in contact with the second region via a second boundary in a plan view with respect to the plane,
• wherein the first region includes a reference region having a contour of a rectangle, and the reference region is set such that four sides of the rectangle are circumscribed to a bonded portion where the first electrode group and the second electrode group are bonded to each other in the plan view,
• wherein a first boundary portion, which is at least a part of the first boundary, is positioned within a range of 0.5 times or more and 5 times or less a length of a short side of the four sides in one direction from one side of the four sides of the reference region toward the outside of the reference region,
• wherein a second boundary portion, which is at least a part of the second boundary, is positioned within a range of 0.5 times or more and 5 times or less the length of the short side in the one direction from the first boundary portion, and
• wherein a density of the second conductive layer in the first region is higher than a density of the second conductive layer in the second region, and the electronic component is arranged on the third region.