H05K 2201/09009
Substrate related
H05K2201/09009 (Substrate related) appears on 6,081 US grants and 6,523 published applications in this corpus.
Search patents in H05K- Granted patents
- 6,081
- Published applications
- 6,523
- Assignees
- 2,228
- Inventors
- 13,304
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 10 | 0 |
| 1978 | 15 | 0 |
| 1979 | 6 | 0 |
| 1980 | 11 | 0 |
| 1981 | 8 | 0 |
| 1982 | 18 | 0 |
| 1983 | 21 | 0 |
| 1984 | 8 | 0 |
| 1985 | 36 | 0 |
| 1986 | 24 | 0 |
| 1987 | 38 | 0 |
| 1988 | 26 | 0 |
| 1989 | 46 | 0 |
| 1990 | 48 | 0 |
| 1991 | 50 | 0 |
| 1992 | 54 | 0 |
| 1993 | 61 | 0 |
| 1994 | 44 | 0 |
| 1995 | 73 | 0 |
| 1996 | 65 | 0 |
| 1997 | 56 | 0 |
| 1998 | 69 | 0 |
| 1999 | 78 | 0 |
| 2000 | 91 | 0 |
| 2001 | 101 | 41 |
| 2002 | 101 | 123 |
| 2003 | 106 | 146 |
| 2004 | 127 | 210 |
| 2005 | 109 | 261 |
| 2006 | 139 | 217 |
| 2007 | 163 | 243 |
| 2008 | 151 | 311 |
| 2009 | 126 | 287 |
| 2010 | 193 | 298 |
| 2011 | 208 | 265 |
| 2012 | 215 | 192 |
| 2013 | 187 | 220 |
| 2014 | 174 | 306 |
| 2015 | 218 | 315 |
| 2016 | 271 | 274 |
| 2017 | 279 | 263 |
| 2018 | 257 | 302 |
| 2019 | 324 | 303 |
| 2020 | 302 | 335 |
| 2021 | 254 | 330 |
| 2022 | 277 | 313 |
| 2023 | 241 | 302 |
| 2024 | 256 | 224 |
| 2025 | 227 | 192 |
| 2026 | 111 | 250 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/09063Holes or slots in insulating substrate not used for electrical connectionsIndexing code1,884
- H05K 2201/09036Recesses or grooves in insulating substrateIndexing code1,344
- H05K 2201/09118Moulded substrateIndexing code657
- H05K 2201/09072Hole or recess under component or special relationship between hole and componentIndexing code496
- H05K 2201/09027Non-rectangular flat pcbIndexing code465
- H05K 2201/09045Locally raised area or protrusion of insulating substrateIndexing code387
- H05K 2201/0909Preformed cutting or breaking lineIndexing code372
- H05K 2201/09081Tongue or tail integrated in planar structureIndexing code325
All 14 subgroupsShow fewer
- H05K 2201/09127Pcb or component having an integral separable or breakable partIndexing code302
- H05K 2201/091Locally and permanently deformed areas including dielectric materialIndexing code268
- H05K 2201/09018Rigid curved substrateIndexing code230
- H05K 2201/09054Raised area or protrusion of metal substrateIndexing code223
- H05K 2201/09136Means for correcting warpageIndexing code206
- H05K 2201/09109Locally detached layersIndexing code129
Recent patents
- Lens module with multi-layer bent circuit board and electronic device having the same6 Oct 2026US 12,757,330 B2Triple Win Technology(Shenzhen) Co. Ltd.
- Camera module29 Sep 2026US 12,750,575 B2LG Innotek Co., Ltd.
- Thermal-control system of a mesh network device and associated mesh network devices29 Sep 2026US 12,750,945 B2Google Inc.
- Power module15 Sep 2026US 12,739,974 B2Hyundai Motor Company
- Membrane circuit board1 Sep 2026US 12,727,079 B2Chicony Electronics Co., Ltd.
- Pcb stack element8 Oct 2026US 2026/0313801 A1Harting, S.A.
- Flexible printed circuit1 Oct 2026US 2026/0304604 A1Isuzu Motors Limited
- Wiring board and method for producing same1 Oct 2026US 2026/0304607 A1KYOCERA Corporation
- Conductive substrate and manufacturing method thereof1 Oct 2026US 2026/0304616 A1DeepWave, Inc.
- Phase shifter assembly1 Oct 2026US 2026/0304625 A1Suzhou Luxshare Technology Co., Ltd.
Most cited
By later US patents
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Method of fabricating compliant interface for semiconductor chip367US 5,659,952 ATessera, Inc. · 1997
- Semiconductor device having dual electrical contact sites344US 5,157,480 AMotorola, Inc. · 1992
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007