Thermal-control system of a mesh network device and associated mesh network devices
AssigneeGoogle Inc.
InventorsIhab A. Ali, Frédéric Heckmann
Life of this patent
Estimating the term…
Abstract
This document describes a thermal-control system (110) that may be integrated into a mesh network device (102) and associated mesh network devices. The thermal-control system (110), which may include a heat sink (112), multiple heat spreaders (114, 118), and a heat shield (116), is such that heat (106) originating from IC devices populating a printed circuit board (104) of the mesh network device (102) may be transferred to a housing component (108) of the mesh network device (102) for external dissipation to maintain a desired thermal profile of the mesh network device (102).
Claims20
An apparatus comprising:
- a printed circuit board populated with one or more integrated circuit devices;
- a thermal-control system configured to transfer heat generated by the one or more integrated circuit devices to a housing component of the apparatus for external dissipation, the thermal-control system comprising:
- a heat sink, the heat sink centered about a central axis, the heat sink in thermal contact with at least one of the one or more integrated circuit devices;
- a first heat spreader, the first heat spreader attached to a first surface of the heat sink;
- a heat shield, the heat shield facing a second surface of the heat sink that is opposite the first surface;
- and
- a second heat spreader, the second heat spreader located between the heat shield and the printed circuit board, the printed circuit board located between the heat shield and the second surface of the heat sink.
An apparatus comprising:
- a housing component, the housing component including an internal cavity region;
- a thermal-control system configured to transfer heat generated by one or more integrated circuit devices to the housing component of the apparatus for external dissipation, the thermal-control system comprising:
- a heat sink that is centered about a central axis, the heat sink including a first surface that faces the internal cavity region and is in thermal contact with at least one of the one or more integrated circuit devices;
- a fan mechanism located between the first surface and the internal cavity region, the fan mechanism having one or more blades configured to rotate;
- and
- a first heat spreader that is:
- attached to the first surface of the heat sink;
- and
- located between the one or more blades of the fan mechanism and the first surface of the heat sink.
Dependencies are inferred from the claim text.