H05K 2201/09054
Raised area or protrusion of metal substrate
H05K2201/09054 (Raised area or protrusion of metal substrate) appears on 223 US grants and 230 published applications in this corpus.
Search patents in H05K- Granted patents
- 223
- Published applications
- 230
- Assignees
- 165
- Inventors
- 493
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 4 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 3 | 0 |
| 2000 | 6 | 0 |
| 2001 | 10 | 2 |
| 2002 | 5 | 3 |
| 2003 | 6 | 5 |
| 2004 | 4 | 7 |
| 2005 | 3 | 6 |
| 2006 | 6 | 14 |
| 2007 | 5 | 18 |
| 2008 | 6 | 13 |
| 2009 | 6 | 12 |
| 2010 | 8 | 35 |
| 2011 | 22 | 28 |
| 2012 | 27 | 10 |
| 2013 | 7 | 9 |
| 2014 | 9 | 12 |
| 2015 | 8 | 4 |
| 2016 | 10 | 4 |
| 2017 | 3 | 6 |
| 2018 | 5 | 9 |
| 2019 | 6 | 6 |
| 2020 | 6 | 3 |
| 2021 | 0 | 6 |
| 2022 | 7 | 5 |
| 2023 | 4 | 6 |
| 2024 | 4 | 5 |
| 2025 | 4 | 1 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring circuit board and wiring circuit board assembly sheet25 Aug 2026US 12,720,677 B2Nitto Denko Corporation
- Substrate structure9 Jun 2026US 12,652,756 B2Subtron Technology Co., Ltd.
- Circuit structure16 Dec 2025US 12,500,362 B2Autonetworks Technologies, Ltd.
- Optical engine module16 Dec 2025US 12,501,536 B2Coretronic Corporation
- Circuit board with convex shaped post, light emitting device, and manufacturing method therefor20 May 2025US 12,309,934 B2Nichia Corporation
- Component Carrier With Protruding Thermal Structure and Manufacture Method30 Apr 2026US 2026/0123409 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Substrate structure13 Mar 2025US 2025/0089162 A1Subtron Technology Co., Ltd.
- Wiring circuit board and wiring circuit board assembly sheet18 Jul 2024US 2024/0244742 A1Nitto Denko Corporation
- Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad Laminate and Printed Circuit Board18 Jul 2024US 2024/0244755 A1Guangzhou Fangbang Electronics Co., Ltd
- Method and system for producing circuit boards with perforated shaped parts16 May 2024US 2024/0164023 A1Jumatech GmbH
Most cited
By later US patents
- Semiconductor device having dual electrical contact sites344US 5,157,480 AMotorola, Inc. · 1992
- Packaging power converters128US 5,973,923 A1999
- Circuit module with enhanced heat transfer and distribution118US 4,628,407 ACray Research, Inc. · 1986
- Dual-sided heat removal system101US 6,580,611 B1Intel Corporation · 2003
- Electrical assembly96US 4,563,725 AWelwyn Electronics Limited · 1986