Substrate structure

Abstract

A substrate structure includes a substrate, an insulation filling structure, a chip, a first circuit layer, a second circuit layer and a conductive connector. The substrate has a first surface and a second surface opposite to each other, wherein the substrate is a thermally and electrically conductive material. The insulation filling structure is disposed in the substrate to separate the substrate into a plurality of regions isolated from each other. The chip is disposed on and in direct contact with the substrate. The first circuit layer is disposed over the first surface of the substrate. The second circuit layer is disposed over the second surface of the substrate. The conductive connector penetrates through the insulation filling material and is electrically connected with the first circuit layer and the second circuit layer.

Dependencies are inferred from the claim text.