Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad Laminate and Printed Circuit Board

Abstract

The disclosure discloses a metal foil, a metal foil with a carrier, a copper-clad laminate and a Printed Circuit Board. Herein, a plurality of protrusions are distributed on one face of the metal foil, and the protrusions have the follow microscopic morphology: the lower half part of the protrusion connected with the one face of the metal foil is provided with a limiting part, and the diameter of a circumscribed circle of the cross section of the limiting part is smaller than the skin depth of the metal foil; and the surface area of the part of the protrusion above the limiting part is larger than the surface area of other parts of the protrusion.

Dependencies are inferred from the claim text.