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US 12,500,362 B2Granted
Circuit structure
AssigneesAutonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
InventorAkira Haraguchi
Life of this patent
Estimating the term…
Abstract
A circuit structure includes a first busbar, a wiring board located on the first busbar and having an open hole, a conductive raised part protruding into the open hole from the first busbar, and a first electronic component having a first connection terminal located on the wiring board. The first connection terminal is electrically connected to the raised part in the open hole.
Claims7
A circuit structure comprising:
- a first busbar having a first metal layer and a second metal layer, the first metal layer formed of aluminum and the second metal layer formed of copper, the second metal layer having a conductive raised part;
- a wiring board located on the first busbar and having an open hole;
- wherein the conductive raised part protruding protrudes into the open hole from the second metal layer of the first busbar;
- a first electronic component having a first connection terminal,
- wherein the first connection terminal is electrically connected to the raised part in the open hole;
- and further comprising:
- a second busbar,
- wherein the first electronic component is provided to straddle between the wiring board and the second busbar, and
- the wiring board is located on a region, on an upper surface of the first busbar, lower than an upper surface of the second busbar.
6 more elements
Dependencies are inferred from the claim text.