Method of manufacturing a semiconductor package

A method of manufacturing a semiconductor package, comprising:

• providing a substrate having at least one circuit pattern and a plurality of electrical terminals on a first side of the substrate;
• mounting a semiconductor die to a second side of the substrate;
• electrically coupling the semiconductor die to the circuit pattern of the substrate;
• encapsulating the semiconductor die and at least the second surface of the substrate;
• ablating via holes through the encapsulation by a laser;
• and
• depositing conductive material within the via holes for coupling a second semiconductor package to the semiconductor package.

A method of manufacturing a semiconductor package, comprising:

• providing a substrate having circuit patterns and a plurality of electrical terminals on a first side of the substrate;
• mounting a semiconductor die to a second side of the substrate;
• electrically coupling the semiconductor die to a circuit pattern of the substrate;
• encapsulating the semiconductor die and at least the second surface of the substrate;
• ablating a plurality of via holes through the encapsulation;
• and
• depositing means within the via holes to form a plurality of terminals on the second surface of the semiconductor package for coupling a second semiconductor package to the semiconductor package.