H05K 2201/091
Locally and permanently deformed areas including dielectric material
H05K2201/091 (Locally and permanently deformed areas including dielectric material) appears on 268 US grants and 200 published applications in this corpus.
Search patents in H05K- Granted patents
- 268
- Published applications
- 200
- Assignees
- 171
- Inventors
- 498
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 11 | 0 |
| 1996 | 8 | 0 |
| 1997 | 7 | 0 |
| 1998 | 5 | 0 |
| 1999 | 6 | 0 |
| 2000 | 7 | 0 |
| 2001 | 6 | 4 |
| 2002 | 5 | 5 |
| 2003 | 9 | 6 |
| 2004 | 6 | 6 |
| 2005 | 4 | 10 |
| 2006 | 7 | 10 |
| 2007 | 4 | 25 |
| 2008 | 10 | 13 |
| 2009 | 13 | 17 |
| 2010 | 16 | 21 |
| 2011 | 17 | 20 |
| 2012 | 12 | 3 |
| 2013 | 9 | 6 |
| 2014 | 7 | 3 |
| 2015 | 4 | 2 |
| 2016 | 2 | 3 |
| 2017 | 2 | 7 |
| 2018 | 7 | 5 |
| 2019 | 8 | 6 |
| 2020 | 5 | 4 |
| 2021 | 7 | 8 |
| 2022 | 2 | 5 |
| 2023 | 4 | 3 |
| 2024 | 7 | 4 |
| 2025 | 2 | 4 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board, manufacturing method thereof, and battery pack including the same4 Aug 2026US 12,701,656 B2LG Energy Solution, Ltd.
- Circuit board and method of fabricating the same21 Apr 2026US 12,610,473 B2China Avary Holding (Shenzhen) Co., Ltd.
- Method for making a three-dimensional liquid crystal polymer electronic device26 Aug 2025US 12,400,810 B2Harris Corporation
- Optically functional multilayer structure and related method of manufacture29 Jul 2025US 12,376,450 B2Tactotek Oy
- Method for producing a panel with integrated electronics3 Dec 2024US 12,160,094 B2Airbus SAS
- Circuit board and method of fabricating the same23 Oct 2025US 2025/0331106 A1Avary Holding (Shenzhen) Co., Limited.
- Optically functional multilayer structure and related method of manufacture3 Jul 2025US 2025/0221159 A1Tactotek Oy
- Circuit board and semiconductor package comprising same19 Jun 2025US 2025/0203761 A1LG Innotek Co., Ltd.
- Systems and Methods for Shaping Flexible Circuits to Improve Routing and Attachment20 Feb 2025US 2025/0063670 A1Aptiv Technologies AG
- Printed Circuit Board, Manufacturing Method Thereof, and Battery Pack Including the Same28 Nov 2024US 2024/0397616 A1LG Energy Solution, Ltd.
Most cited
By later US patents
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Method of fabricating compliant interface for semiconductor chip367US 5,659,952 ATessera, Inc. · 1997
- Microelectronic mounting with multiple lead deformation and bonding201US 5,801,441 ATessera, Inc. · 1998
- Fan-out semiconductor chip assembly189US 5,688,716 ATessera, Inc. · 1997
- Process for mounting electronic device and semiconductor device167US 6,208,525 B1Hitachi Hokkai Semiconductor, Ltd. · 2001