Printed Circuit Board, Manufacturing Method Thereof, and Battery Pack Including the Same
AssigneeLG Energy Solution, Ltd.
InventorsJae Young Jang, Jin Hyun Lee, Min Su Son
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Abstract
A printed circuit board includes an inner layer; a first insulating layer formed on an upper part of the inner layer; a first copper foil layer formed on an upper part of the first insulating layer; and a solder resist layer formed on an upper part of the first copper foil layer. When welding a metal tab onto the solder resist layer, a welding portion that couples the metal tab and the first copper foil layer is formed, and a gap is formed at a portion adjacent to the welding portion.
Claims19
A printed circuit board comprising:
- an inner layer;
- a first insulating layer disposed on an upper part of the inner layer;
- a first copper foil layer disposed on an upper part of the first insulating layer;
- and
- a solder resist layer disposed on an upper part of the first copper foil layer,
- wherein the solder resist layer is configured to receive a metal tab by welding, so as to form a welding portion that couples the metal tab and the first copper foil layer, and
- wherein a gap is located at a portion adjacent to the welding portion.
(canceled)
A manufacturing method of a printed circuit board, the method comprising the steps of:
- disposing a first insulating layer on an upper part of an inner layer;
- disposing a first copper foil layer on an upper part of the first insulating layer;
- and
- disposing a solder resist layer on an upper part of the first copper foil layer,
- wherein the solder resist layer receives a metal tab by welding to form a welding portion that couples the metal tab and the first copper foil layer, and
- wherein a gap is formed at a portion adjacent to the welding portion.
Dependencies are inferred from the claim text.