Process for mounting electronic device and semiconductor device
AssigneesHitachi, Ltd., Hitachi Hokkai Semiconductor, Ltd.
InventorsSatoshi Imasu, Ikuo Yoshida, Tetsuya Hayashida, Akira Yamagiwa, Shinobu Takeura
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Abstract
An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.
Claims12
An electronic device, comprising:
- a semiconductor chip having a first surface and a second surface which is opposite to said first surface, elements and a plurality of external terminals formed on said first surface, a plurality of bumps, each formed on said external terminals, respectively;
- a wiring board which is made of a rigid material, said wiring board having a main surface;
- a soft layer, which is softer than said wiring board, formed over said main surface of said wiring board;
- a plurality of wirings formed over said soft layer, passivation film that covers each of said wirings and said soft layer;
- and
- a plurality of electrode pads formed on said soft layer, each of said electrode pads being electrically connected to said plurality of wirings, respectively,
- wherein said semiconductor chip is fixed to said wiring board through said plurality of bumps and an adhesive, and said electrode pads and said bumps are electrically connected, and
- wherein said passivation film is not formed between said first surface of said semiconductor chip and said soft layer.
An electronic device, comprising:
- a semiconductor chip having a first surface and a second surface which is opposite to said first surface, elements and a plurality of external terminals formed on said first surface, a plurality of bumps, each formed on said external terminals, respectively;
- a wiring board which is made of a rigid material, said wiring board having a main surface;
- a soft layer, which is softer than said wiring board, formed over said main surface of said wiring board;
- a plurality of wirings formed over said soft layer, passivation film that covers said each of said wirings and said soft layer;
- and
- a plurality of electrode pads formed on said soft layer, each of said electrode pads being electrically connected to said plurality of wirings, respectively,
- wherein said semiconductor chip is fixed to said wiring board through said plurality of bumps and an adhesive so that recesses are formed in said electrode pads, and said electrodes pads and said bumps are electrically connected in said recesses, and
- wherein said passivation film is not formed between said first surface of said semiconductor chip and said soft layer.
Dependencies are inferred from the claim text.