Optically functional multilayer structure and related method of manufacture

A method for manufacturing an integrated optically functional multilayer structure, comprising:

• obtaining a flexible, 3D-formable and thermoplastic, substrate film;
• providing at least a first side of the substrate film with a circuit design comprising a number of electrical conductors by printed electronics technology;
• arranging at least one light source upon the first side of the substrate film as connected to the circuit design;
• and
• producing through molding including injection molding, high pressure molding, low pressure molding, silicone molding or using one or more other manufacturing methods, an optically transmissive layer upon the first side of the substrate film and the at least one light source, said optically transmissive layer at least partially covering the substrate film and embedding the at least one light source,
• wherein the further method comprises establishing a light outcoupling surface, at least partially tilted away from a surface plane or direction defined by adjacent areas of the substrate film, from at least one of said substrate film or optically transmissive layer,
• wherein the method further comprises obtaining the substrate film and providing the substrate film with a pattern or area for outcoupling light from the internals of the structure to an environment of the structure, and
• wherein the structure further comprises an electrically conductive shielding layer on a second, opposite, side of the substrate film, disposed upon at least one intermediate layer including an adhesive layer and at least one additional layer including a further adhesive layer, including an adhesive tape layer, on a side of the shielding layer opposite to the side facing the substrate film and configured to face and contact an external and potentially electrically conductive host surface.