H05K 2201/09045
Locally raised area or protrusion of insulating substrate
H05K2201/09045 (Locally raised area or protrusion of insulating substrate) appears on 387 US grants and 347 published applications in this corpus.
Search patents in H05K- Granted patents
- 387
- Published applications
- 347
- Assignees
- 251
- Inventors
- 920
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 6 | 0 |
| 1989 | 6 | 0 |
| 1990 | 5 | 0 |
| 1991 | 5 | 0 |
| 1992 | 7 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 8 | 0 |
| 1997 | 6 | 0 |
| 1998 | 4 | 0 |
| 1999 | 11 | 0 |
| 2000 | 10 | 0 |
| 2001 | 8 | 5 |
| 2002 | 13 | 14 |
| 2003 | 11 | 8 |
| 2004 | 14 | 15 |
| 2005 | 5 | 14 |
| 2006 | 12 | 10 |
| 2007 | 10 | 21 |
| 2008 | 9 | 13 |
| 2009 | 7 | 24 |
| 2010 | 10 | 21 |
| 2011 | 9 | 10 |
| 2012 | 11 | 6 |
| 2013 | 12 | 11 |
| 2014 | 12 | 14 |
| 2015 | 9 | 22 |
| 2016 | 16 | 13 |
| 2017 | 13 | 12 |
| 2018 | 12 | 13 |
| 2019 | 22 | 13 |
| 2020 | 11 | 15 |
| 2021 | 6 | 14 |
| 2022 | 14 | 16 |
| 2023 | 10 | 15 |
| 2024 | 18 | 11 |
| 2025 | 9 | 10 |
| 2026 | 6 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and semiconductor package having the same25 Aug 2026US 12,721,201 B2LG Innotek Co., Ltd.
- Fabrication of three-dimensional kirigami structures with tunable properties18 Aug 2026US 12,709,080 B2Massachusetts Institute of Technology
- Flexible circuit board11 Aug 2026US 12,707,564 B2Chipbond Technology Corporation
- Base member, electronic device, and structure2 Jun 2026US 12,648,078 B2Canon Kabushiki Kaisha
- Dimple on circuit board for providing standoff between circuit board and circuit package12 May 2026US 12,628,270 B2Dell Products L. P.
- Base member, electronic device, and structure17 Sep 2026US 2026/0282217 A1Canon Kabushiki Kaisha
- Wiring board, electronic device, and electronic module17 Sep 2026US 2026/0282236 A1KYOCERA Corporation
- Circuit board for bypass diode, bypass diode device, and solar battery module20 Aug 2026US 2026/0247535 A1KYOCERA Corporation
- Electronic device comprising a single dielectric layer for solder mask and cavity and method for fabricating the same25 Jun 2026US 2026/0182422 A1Qorvo US, Inc.
- Printed circuit board7 May 2026US 2026/0129753 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Plated plastic castellated interconnect for electrical components301US 5,069,626 AWestern Digital Corporation · 1991
- Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice295US 5,483,741 AMicron Technology, Inc. · 1996
- Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability236US 5,326,428 AMicron Semiconductor, Inc. · 1994
- Three-dimensional microwave circuit carrier and integral waveguide coupler226US 5,045,820 AMotorola, Inc. · 1991